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Conference Sessions [clear filter]
Thursday, June 29
 

10:00am

O1: Integrated Optical Sensors Challenges and Solutions

Target detection, distance and brightness measurements are basic requirements in industrial automation and safety. Industry 4.0 demands smart solutions: exact sensing, tiny design, smart connectivity, low power consumption, universal and cheap. This session will give an overview including pros and cons about principles of integrated optical sensors.


Speakers
avatar for Marko Mai

Marko Mai

Digital Design Engineer, CREATIVE CHIPS GmbH
avatar for Lutz Porombka

Lutz Porombka

Managing Director & CEO, Creative Chips GmbH
Dr.-Ing. Lutz Porombka has studied electronics in Dresden and made his doctors degree beginning of the 80th. Since this time he is involved in IC design and worked in several responsible positions at different semiconductor companies. In 1999 he founded together with three other semiconductor... Read More →


Thursday June 29, 2017 10:00am - 10:50am
Executive Ballroom H

11:00am

O2: How to Solve the Six Most Common Sensor Challenges

Analog designers require solutions to highly complex sensing problems in today’s world. Challenges like ambient light, reliable presence detection, package size, and harsh environments vex designers on a regular basis as they develop solutions for critical applications. In this session, Brooks will uncover strategic approaches on how to effectively address some of the most common sensor issues in the industry using integrated optical sensing technology.


Speakers
avatar for Walter Brooks

Walter Brooks

Applications Engineer Manager, TT Electronics
Walter Garcia Brooks is a Field Applications Engineer for TT Electronics / OPTEK Technology. Walter has been in the optoelectronics industry since 2004 and has held the following positions in the past: Test Engineer, Product Engineer, Business Development Manager and Field Applications... Read More →


Thursday June 29, 2017 11:00am - 11:50am
Executive Ballroom H

1:30pm

O3: Line Confocal Imaging Sensors - New Technology for Measuring 3D Surface Features at Sub-Micron Resolution

This session introduces the Line Confocal Imaging (LCI) method and sensors that enable high-speed 3D measurement of highly reflective, transparent, curved and other surfaces and features that are difficult or impossible to measure with traditional methods, such as laser triangulation. LCI’s strengths and weaknesses are discussed and various LCI sensor applications will also be explored.


Speakers
JS

Juha Saily

Sales Manager, FocalSpec, Inc.
Juha Saily is a technical sales professional with FocalSpec, Inc., located in Metro Atlanta, Georgia. He is a graduate of the Raahe Institute of Computer Engineering in Raahe, Finland, with a Bachelor Degree in Computer Engineering. Prior to joining FocalSpec, Juha held various technical... Read More →


Thursday June 29, 2017 1:30pm - 2:20pm
Executive Ballroom H

2:30pm

O4: Fiber Optic Sensing: A Visible Alternative
Over the past decade, fiber optic sensing has advanced and is emerging as a fitting alternative to traditional electrical sensors, yet not many realize the potential and advantages of this technology. Composed only of glass, fiber optic sensors are intrinsically safe and offer advantages over electrical sensors; they are not sensitive to electromagnetic interference (EMI), can be remoted located (upwards of 25km's away) and can be used in harsh environments. These sensors can be applied to measure mechanical forces such as pressure, flow, load and temperature (to name just a few).

This presentation will highlight optical sensor manufacturing processes, and real-world applications of fiber optic sensors versus conventional strain gauges in industries including: Transportation, Oil and Gas, and Aerospace. A customer case study, evaluating the performance of optical gauges vs. foil strain gauges with Celestica will be presented and the results will be discussed.

Speakers
avatar for Nick Burgwin

Nick Burgwin

Test Engineer, Fibos Inc.


Thursday June 29, 2017 2:30pm - 3:20pm
Executive Ballroom H